Uni-Logo
Sie sind hier: Startseite Professuren Paul, Oliver Mitarbeiter Persönliche Mitarbeiterseiten Prof. Dr. Oliver Paul

Prof. Dr. Oliver Paul

Curriculum Vitae

Bild Paul Mitarbeiterseite

 

 

 

 

 

 

 

 

 

 

 

 

Research Interests

Former PhD Students

Research Activities

Professional society affiliations, activities, honors

Teaching

Languages

Patents, publications, presentations


Research Interests

  • Microsystems for physical sensing and biomedical applications
  • Materials and fabrication technologies for microsystems
  • Material properties of thin films
  • Microelectromechanical systems (MEMS) based on commercial IC processes
  • Quantitative, physical understanding of MEMS

 

Former PhD Students

Dominique Jaeggi Bookham Switzerland AG
Martin von Arx ESEC SA, Cham, Switzerland
Niklaus Schneeberger Debiotech, Lausanne, Switzerland
Felix Mayer Co-Founder and CEO, Sensirion AG, Stäfa, Switzerland
Michael Mayer Professor, University of Waterloo, Canada
Volker Ziebart Mettler-Toledo GmbH, Nänikon, Switzerland
Torsten Kramer Robert Bosch GmbH, Reutlingen, Germany
Michael Ehmann Stiftung Caesar, Bonn, Germany
Simon Armbruster Robert Bosch GmbH, Reutlingen, Germany
Ulrich Wagner Robert Bosch GmbH, Gerlingen-Schillerhöhe, Germany
Julian Bartholomeyczik Northrop Grumman Litef GmbH, Freiburg, Germany
Michael Doelle Silicon Microstructures, Milpitas, USA
Achim Trautmann Robert Bosch GmbH, Stuttgart, Germany
Simon Brugger Testo AG, Lenzkirch, Germany
Martin Cornils Micronas GmbH, Freiburg, Germany
Jochen Held University of Tübingen, NMI, Reutlingen, Germany
Sebastian Kisban UP-MED GmbH, München, Germany
Ulrich Bartsch Sensirion AG, Stäfa, Switzerland
Stefan Hillebrecht University of Freiburg, IfI, Freiburg, Germany

Research Activities

1998-date Research in process technology, materials preparation and characterization for MEMS based on silicon technology and related technologies; silicon based MEMS devices and systems.
 
  • Technology, materials, and processes for silicon-based MEMS:
   
  • KOH, TMAHW, DRIE, porous silicon etching
   
  • Through-wafer contacting
   
  • Surface micromachining: LTO and AL sacrificial layer micromachining
   
  • High-temperature (900°C) use of CMOS membranes
   
  • Nanomachining
       
 
  • Characterization of MEMS materials, processes, and devices:
   
  • Mechanical thin film properties: bulge and microtensile testing, indentation and shear testing; elastic properties, thermal expansion, fracture properties
   
  • Thermal thin film properties: dedicated test microstructures; thermal conductivity, heat capacity, thermoelectric coefficients
   
  • Reliability and aging properties of MEMS materials:
    shock resistance and cyclic fatigue
   
  • Packaging process characterization using FET-based stress sensor arrays
   
  • Electrical, thermal, mechanical, optical, magnetic testing of MEMS devices and systems
       
 
  • Development of MEMS for applications:
   
  • Microneedles and nanoneedles for dermatology and life sciences
   
  • Neural probes
   
  • Integrated stress sensors for packaging testing and force and torque sensing
   
  • Microstructures combined with magnetic shape memory alloys
   
  • Tactile sensor systems
   
  • Pressure sensor technology
   
  • Semiconductor Hall sensors
   
  • Resonant magnetic sensors
   
  • High temperature sintering of transducer ceramic thin films on CMOS
   
  • FET-based gas sensors, surface conductivity
   
  • Thin film membrane based thermal sensors
   
  • Differential scanning microcalorimetry
       
1996-1998 Swiss Priority Program MINAST (Micro and Nano System Technology)
 
  • Deputy module coordinator and project leader. Coordination and supervision of five projects (1,855,000 Swiss Francs in 1996), interaction with Program Management, and contract negotiations with industrial partners
   
1992-1998 Microsensors, Microsystems, Silicon Technology
 
  • CMOS-compatible microsensors and microsystems to measure infrared radiation, gas flow, pressure, relative humidity, and acceleration;
 
    New process technologies for IC microsensor fabrication;
 
    Micromechanical test structures to measure thermo- electromechanical properties of IC thin films;
 
    Novel sensor packaging technologies
   
1991-1992 Silicon Solar Cell Physics and Technology
 
  • High efficiency (>20%) monocrystalline Si solar cells;
 
    Implementation of boron rear-field technology
   
1987-1991 Surface Physics, Magnetism
 
  • Magnetic surfaces, adsorbates, and thin films using spin-polarized Auger and secondary electron spectroscopy (Ph.D. thesis)
   
1986 Neutron Scattering, Magnetism

 

 

 

  • Spin wave and cluster excitations of CsMnx Mg1-x Br3 by inelastic neutron scattering (equivalent of M.S. thesis)

Professional society affiliations, activities, honors

Conference: 2009: Mikrosystemtechnik-Kongress, Transducers, Eurosensors
Program: 2008: Eurosensors, IEEE Sensors, Smart Systems Integration
Comittees: 2007: IEEE Sensors, Smart Systems Integration
  2004: IEEE MEMS 2004 Conference General Co-Chair
  2002-2006: IEEE MEMS Conference International Steering Committee
  1998-2003: IEEE MEMS Conference Technical Program Committee
  1996-1999: SPIE Conferences on Micromachined Devices and Components
 Editorial:  2007-date: Transactions on Electrical and Electronic Engineering (IEE Japan)
 Board:  2005-date: Journal Micromechanics and Microengineering (IOP)
   1995-date: Sensors and Actuators A (Elsevier)
 Membership:  Institute of Electrical and Electronic Engineers IEEE
 Journal:  Sensors and Materials
 Reviewing:  IEEE Sensor Journal
    IEEE Transactions on Electron Devices
   IEEE Electron Device Letters
   IEEE/ASME Journal of Microelectromechanical Systems
   Journal of Applied Physics
   Journal of Electroceramics
   Journal of Micromechanics and Microengineering
   Microsystem Technologies
   Nanotechnology
   Sensors and Actuators A
 
 Thermochimica Acta
 Awards:   IEEE Sensors 2009: with PhD student M. Baumann, 2nd best poster award
   InterPack 2009: with PhD student Benjamin Lemke, best poster award of session
   Eurosensors 2008: with PhD student P. Gieschke, 3rd best poster award
   2007: Arnold-Biber-Award of The German Orthodontic Society, with PD Dr. B. Lapatki
   IEEE Sensor 2003: with PhD student J. Bartholomeyczik receives Samsung Award for 2nd best student paper
   IEEE ICMTS 1999, best paper award
   IMAPS 1998, best paper of session award
   IEDM 1997, PhD student F. Mayer received IEEE R. A. Haken Award
   IEEE ICMTS 1996, best paper award
   Micromechanics Europe 1996 Workshop, best poster award
   Polya Award of ETH Zurich for Best Physics Diploma examination result, 1986
 Co-Founder:  1998-date: Sensirion AG, Stäfa, Switzerland, with 185+ employees

 

 

Teaching

 

Languages

 

Fluent: German, English, French, Swiss German
Basic knowledge:
Italian, Spanish, Japanese

Patents, publications, presentations

 

3 patents
Over 280 publications in scientific journals, conference proceedings, books
Over 100 oral scientific presentations

 

Benutzerspezifische Werkzeuge