Biocompatible Assembling and Packaging Technology

Biocompatible Assembling and Packaging Technology

The technological background for the above mentioned applications will be described and developed in the research in the field of biocompatible assembling and packaging technology.

We will focus on flexible microsystems that use polymers as substrate as well as insulation and packaging material. The combination of hybrid integrated circuits for signal processing and / or telemetry with flexible carriers with monolithically integrated interconnects and electrode arrays allow ultra light-weighted implants that match the high requirements of structural biocompatibility. Our developments aim towards modular systems to reach the target specifications of different applications with the lowest number of different modules. Our aim within biomedical microimplants is the development of flexible encapsulation and packaging concepts to overcome ceramic and titanium housings for total flexible implants. The long term stability of the implants will be obtained with multilayer encapsulations, e.g with polyimide, parylene and silicone rubber. Special attention will be drawn on the surface pre-treatment (e.g. by plasma) of the materials to be connected.